COMMON QUESTION/ANSWER
THE CLEANING PROCESS:
Is the cleaning process required before bonding / coating process?
Cleaning process is very important before making bonding and coating processes, in order to improve the feature of attaching material between the components and the surface. The cleaning purpose is to remove oil and tin residues, melting the solder pastes, and any other pollutant. Insufficient cleaning process, can lead the material to peel off.
What are the risks during cleaning circuit processes?
There are sensitive electronic components that are not resistant to electronic detergents, and washing them in the "Degreaser" may lead to irreparable damage.
In those cases, a selective cleaning process (manually) will perform the work required.
How can we know if the circuit cleaning process was completed successfully?
After the cleaning process, an advanced pollution test with innovative technology, checks the PCB in order to detect and confirm the quality of cleanliness. According to the test results, we will know whether to continue with the protection process (bonding and coatings).
BONDING AND GLUING PROCESS:
Why bonding components is required?
Bonding / Gluing components is required in order to allow survival in harsh environmental conditions, including: vibration and hit. Bonding processes are carried out according to international standard: IPC-A-610D Class III.
Is it possible to remove bonding material from component after the process?
Glue Dots can be removed but in some conditions. Removing the glue is done professionally with appropriate technology in order not to damage the integrity of the circuit.
THE COATING PROCESS:
What is the conformal coating purpose?
Coating electronic circuits designed to provide protection for electronic components and systems. The coating creates a protective layer between the PCB and the environment and preventing various kinds of hazards which could damage the survival capability, its functioning and / or integrity (including: shorts, corrosion, fungus, bacteria, damages to the soldering and the surface of the circuit board and many other damages for the integrity of the components, the circuit and the entire system).
What are the steps of the final testing?
– A magnification visual inspection.
– Testing under UV light.
– FOD (foreign object damage) test.
– Coating adhesion test – using glue strip testing.
– Coating thickness test.
How to measure the coating thickness?
In order to measure the coating thickness, a coupon added to the coating process. This coupon is partially masked before coating process together with all circuits. After coating, thickness measured on both sides using a calibrated micrometer. The results is written in accompanying tag and the C.O.C provided to the customer.
Is it possible to remove coating from PCB?
It possible to remove coating, but it's depends on the material type.
Acrylic coating (1B31, 1B73) can be remove.
Polyurethane coating (1A33, 1A20), is partially removable by manually cleaning.
Silicone coating is impossible to remove from the circuit overall.
Do you have another question? We would be happy to serve you by phone:
03-9208200 ext 250.
